Product Description
SA310FG high conductivity thermal adhesive tape is widely used to bond heat sinks to microprocessors and other power consuming semiconductors. SA310FG high conductivity thermal adhesive tape has strong adhesive strength and low thermal resistance, which can effectively replace silicone grease and Mechanically fixed.
Applications
◆ Chassis, frame or other cooling components
◆ Large capacity drive
◆ Heat pipe assembly
◆ RDRAM memory
◆ High frequency micro processing chip
◆ Notebooks and desktop computers
Videos
Product Parameters
SA310FG | ||
Color | White | Visual |
Basic material | Acrylate (acrylic) | *** |
Strengthening of basic materials | Glass fiber mesh | *** |
Thickness(mm) | 0.25±0.01 | ASTM D374 |
Breakdown voltage(V) | >4600 | ASTM D149 |
Release force(kg/mm) | 2.5kg/25mm | PSTC-3 |
Shear strength 1.0 kg loading on 25 mm x 25 mm | > 48 hrs | PSTC-7 |
Thermal resistance 0.5kg loading on25mm x 25mm at 80℃ | > 24 hrs | *** |
Thermal Conductivity (W/mk) | 1.0 | ASTM D5470 |
Operating Temperature | -30℃ ~ 130℃ | *** |
RoHS | PASS | IEC 62321 |
Halogen | PASS | EN14582 |
REACH | PASS | EN14372 |
SA series Thermal adhesive tape | |||||
Sheen Thermal adhesive tape series | Thermal conductivity | Carrier material | Adhesion to steel(kgf/25mm) | Thickness(mm) | Remark |
SA600-AL | 1.3 W/mK | Aluminum foil | 1.5 | 0.16 | |
SA410FG | 1.0 W/mK | Fiberglass | 1.2-1.8 | 0.25±0.01 | |
SA408FG | 1.0 W/mK | Fiberglass | 1.2-1.8 | 0.2±0.01 | |
SA406FG | 1.0 W/mK | Fiberglass | 1.2-1.8 | 0.15±0.01 | |
SA310FG | 1.0 W/mK | Fiberglass | 1.2-1.8 | 0.25±0.01 | Flame retardant |
SA308FG | 1.0 W/mK | Fiberglass | 1.2-1.8 | 0.2±0.01 | Flame retardant |
SA408 | 1.0 W/mK | / | 1.2-1.8 | 0.2±0.01 | |
SA406 | 1.0 W/mK | / | 1.2-1.8 | 0.15±0.01 | |
SA310 | 1.0 W/mK | / | 0.25±0.01 | 0.25±0.01 | Flame retardant |
SA308 | 1.0 W/mK | / | 1.2-1.8 | 0.2±0.01 | Flame retardant |
SA306 | 1.0 W/mK | / | 1.2-1.8 | 0.15±0.01 | Flame retardant |
SA700 | 1.5 W/mK | / | 1.8 | 0.2-0.5±0.01 | Flame retardant |
Customization Ability
About Us
Dongguan Sheen Electronic Technology Co., Ltd is a high-tech enterprise which dedicates to develop, produce and sale of thermal conductive materials and thermal insulation materials, For now the main products are thermally conductive pad, thermally conductive gel, thermal grease, phase change thermal grease, phase change thermal interface materials, thermally conductive tape, foam silicone sheet, thermal silicone adhesive, thermal insulation materials, they are widely used in cell phone, power supplies, LED lights, computers, automotive electronic, network communications, electrical and mechanical equipment, instrumentations, electrical and electronic fields and so on.
Contact Us
Tel | +86-769-22479425 | Address | Building M, Jinxiongda S&T Park, Dalingshan Town, Dongguan City, Guangdong, China |
Fax | +86-769-82784017 | ||
Web | https://www.sheenthermal.com | [email protected] | |