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usheenthermal
GSF75-03 Graphene Thermal Pad
Use Range:
In graphene thermal pads, graphene is aligned along the longitudinal direction, forming a continuous and highly efficient thermal conduction network. This product exhibits excellent compressive resilience, achieving low interfacial thermal resistance even under low pressure. It effectively fills the thermal interface, resulting in highly efficient heat dissipation at the interface.
Thermal Conductivity (W/m·K)： 75.0W/mK
To request a sample of our Graphene Thermal Pads or inquire about more product information, please email us at sales3@u-sheen.com or request a product sample.
◆ AI chips
◆ Intelligent driving chips
◆ Optical modules
◆ Communication equipment
◆ Drones
◆ Humanoid robots
This product is non-toxic and should be stored and transported as a non-hazardous material.
Dongguan Sheen Electronic Technology Co., Ltd.
◆ Founded: 2008
◆ Team: 200 employees
◆ Facility: 20,000㎡
◆ Focus: R&D and production of functional materials
◆ Strengths: Efficient, collaborative team
◆ Achievements: Key supplier to leading global manufacturers
◆ Applications: Telecom, Automotive, Medical, Computing, Industrial , Military
◆ Certifications: ISO9001:2015, ISO14001:2015, IATF16949:2016
Product Description
SHEEN's GSF75-03 Graphene Thermal Pad are renowned for their outstanding performance characteristics, which include:
◆ Provides excellent thermal conductivity, with a thermal conductivity coefficient of up to 75.0 W/mK.
◆ Available in various thicknesses from 0.3 to 2.0 mm.
◆ Excellent flame retardant.
◆ Low thermal resistance.
◆ Customizable shapes per client requirements.
◆ Compliant with RoHS, Halogen-free, REACH environmental and safety standards.
◆ Excellent flexibility, resilience, and thermal stability.
◆ Provides excellent thermal conductivity, with a thermal conductivity coefficient of up to 75.0 W/mK.
◆ Available in various thicknesses from 0.3 to 2.0 mm.
◆ Excellent flame retardant.
◆ Low thermal resistance.
◆ Customizable shapes per client requirements.
◆ Compliant with RoHS, Halogen-free, REACH environmental and safety standards.
◆ Excellent flexibility, resilience, and thermal stability.
【Applications】
◆ AI chips
◆ Intelligent driving chips
◆ Optical modules
◆ Communication equipment
◆ Drones
◆ Humanoid robots
Properties
| Properties | Unit | GSF75-03 Graphene Thermal Pad | Test Method |
| Color | - | Black | Visual |
| Thermal Conductivity | W/m·K | 75 | ASTM E1461 |
| Thermal Resistance (@40psi) | ℃*cm2/W | ≤0.12 | ASTM D5470 |
| Thickness | mm | 0.3~2.0 | ASTM D374 |
| Density | g/cm³ | 0.3~0.7 | ASTM D792 |
| Rebound Rate | % | ≥90 | - |
| Tensile Strength | Mpa | ≥0.03 | ASTM D412 |
| Oil Bleeding Rate | % | ≤3 | / |
| Application Temperature | ℃ | -40~150 | / |
【Product Specifications】
Die-cut products: Customized【Storage & Transportation】
Store in a well-ventilated, cool, and dry area. Keep away from open flames.This product is non-toxic and should be stored and transported as a non-hazardous material.
【Packaging】
Customized packaging according to customer requirements.
About Us
◆ Founded: 2008
◆ Team: 200 employees
◆ Facility: 20,000㎡
◆ Focus: R&D and production of functional materials
◆ Strengths: Efficient, collaborative team
◆ Achievements: Key supplier to leading global manufacturers
◆ Applications: Telecom, Automotive, Medical, Computing, Industrial , Military
◆ Certifications: ISO9001:2015, ISO14001:2015, IATF16949:2016
Partners
Certifications
Videos
For more details, please click on the following website.
https://www.youtube.com/watch?v=os7QqK-tybE
https://www.youtube.com/watch?v=os7QqK-tybE