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usheenthermal
In modern high-power electronics, teams commonly use two methods to dissipate heat: thermally conductive gap fillers (dispensing, phase change materials, curing adhesives) and thermally conductive gap pads (pre-formed compressible sheets/die-cut parts). This article explains the differences between these two methods and provides a comprehensive comparison of these two key thermally conductive interface materials (TIMs) across six engineering areas: physical properties, assembly costs, and long-term reliability, ensuring you choose the right solution for your specific application.
In the field of thermal management, air is the main enemy. Air has a thermal conductivity of only approximately 0.026 W/mK, significantly hindering heat dissipation efficiency. Choosing the right thermal gap pad can replace this air, allowing heat to be predictably transferred from the device to the heat sink. This is where thermal gap pads come into play. For reliability engineers, choosing the right gap pad is not just about lowering temperature; it's about ensuring your product functions correctly in real-world applications, rather than being returned for repair.
Research by SHIEN Technology has revealed that with the continuous development of fields such as artificial intelligence, electric vehicles, and communication equipment, thermally conductive adhesives, as a thermal interface material, have transformed from a convenience requirement to a critical need, playing a decisive role in application structures.
Silicone thermal interface materials remain one of the most widely adopted solutions for enhancing electronic device performance and ensuring operational stability. This comprehensive overview of silicone thermal interface materials provides guidance on selecting the appropriate type of thermal interface material (TIM) and practical design considerations to help maintain consistent thermal performance throughout the product lifecycle.
Any electronic component requires heat dissipation wherever heat is generated. Among all thermal interface materials (TIMs), thermal prase remains the preferred thermal material for thermal management solutions due to its low thermal resistance and excellent wettability. However, proper application is essential. Master thermal paste application with this engineering guide. Learn optimal bond-line thickness (BLT), surface prep techniques, and common mistakes to avoid.
Heat poses an invisible threat to electronic devices, its damage far exceeding expectations. This article provides a free, practical guide to selecting thermal interface materials by analyzing the working principles and physical parameters of thermal paste and thermal pads.
In a region with temperatures as low as -30°C, a new energy vehicle suddenly lost control while driving, resulting in a traffic accident. Subsequent investigations revealed that the incident was caused by a short circuit in the vehicle's battery pack due to seal failure in the cold environment. This real-world incident underscores that battery pack sealing technology is fundamental to new energy vehicle safety. Silicone foam—a novel eco-friendly material formed by heating and vulcanizing liquid silicone—has emerged as a preferred solution for battery pack sealing due to its high compressibility, excellent resilience, superior shock absorption, and sealing properties.
Thermal pads are widely used in GPUs, electric vehicle battery modules, power electronic devices, 5G communication equipment, and LED lighting systems. However, in countless forums, reviews, and customer feedback, one question repeatedly arises: "Will the thermal pad in my device melt?" This is a legitimate concern, as a melted thermal pad could lead to catastrophic failures, causing short circuits and overheating. A simple and reassuring answer is: a properly selected, high-quality thermal pad will not melt within its specified operating temperature range.
In today's era of rapid advancement in new energy vehicle batteries and energy storage systems, the reliability of thermal management directly determines product performance, safety, and lifespan. We frequently hear customer feedback: Traditional thermal silicone pads lack sufficient adhesion to products. Under prolonged vibration, they easily loosen or detach, causing thermal resistance to surge and resulting in highly unstable heat dissipation—ultimately severely impacting battery lifespan." This feedback exposes the core shortcomings of conventional thermal solutions in adhesion and thermal stability. As a company dedicated to innovation in thermal management materials, Sheen Technology deeply understands these challenges and has developed targeted solutions.
Still struggling with choosing the right thermal pad for your GPU? This decision is crucial. Sheen Technology specializes in thermal management solutions and will guide you through material selection based on thickness, flexibility, thermal conductivity, and other key factors.
Discover why boron nitride is emerging as the next-generation thermal interface material. With exceptional thermal conductivity and electrical insulation, BN redefines heat dissipation in 5G, EVs, AI chips, and power electronics. Learn how Sheen Technology pioneers advanced thermal management through BN material innovation.
Discover whether thermal pads are electrically conductive or not. Learn how thermally conductive yet electrically insulating pads improve heat dissipation in EVs, 5G, and power electronics. Explore advanced thermal interface materials and insulation solutions from a leading thermal management technology company.
This article explores how low-density thermal gels revolutionize new energy vehicle thermal management with lightweight design, high thermal conductivity, and precise application. Discover technical breakthroughs in battery cooling, range optimization, fast charging performance, and safety certification for automotive-grade thermal solutions.
This article explores how high-conductivity, high-resilience carbon fiber thermal pads break through server cooling bottlenecks. Facing the challenge of kW-level chip TDP, these pads, with directional thermal conductivity of 15-45W/mK, can reduce temperature delta by over 20°C compared to traditional materials, enhancing computing reliability and preventing performance throttling. Their superior compression recovery ensures long-term low contact thermal resistance and can reduce data center cooling energy consumption by 10-15%, optimizing operational costs and PUE for efficient, green computing infrastructure.
Boron Nitride Thermal Pads provide an innovative cooling solution for 5G base stations, offering high thermal conductivity (12-20W/MK) and excellent electrical insulation (10¹⁴–10¹⁶Ω·cm). These advanced thermal interface materials reduce chip temperatures by 18°C, extend equipment lifespan by 2.8 years, and lower energy consumption by 15%. Ideal for harsh environments including high humidity and coastal areas, they are emerging as the preferred thermal management material for next-generation 5.5G/6G infrastructure.
Sheen Technology Co., Limited.
Address: Flat/Rm 1405A 14/F The Belgian Bank Building Nos.721-725 Nathan Road MongKok KL HK
Tel: +86 13728278261
Dongguan Sheen Electronic Technology Co., Ltd.
Tel:+86-769-22479425
E-mail:Tina: marketing@u-sheen.com
WeChat/Phone: +86 13728278261
WhatsApp: +86 13542243751
Add: Room 101, 201, 301, 401, Building 2, No. 8 Hengzhutang Road, Liaobu Town, Dongguan City, Guangdong Province ,China
