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usheenthermal
Advanced High Thermal Conductivity Materials
Sheen Technology provides comprehensive thermal management solutions, developing high-performance graphene thermal pad, carbon fiber thermal pads, and boron nitride thermal materials to enhance thermal conductivity.
- Superior Thermal Conductivity:70 W/m·K
- Reliable Performance: Consistent thermal resistance under varying conditions
- Wide Application Range: From consumer electronics to automotive systems
- Customized Solutions: Tailored formulations for specific requirements
High Thermal Conductivity Materials Selection Guide
Provide novel thermal interface material solutions to meet high thermal conductivity and performance requirements.
Graphene Thermal Pad
- Thermal conductivity: 70 W/mK.
- Thickness: 0.3-10mm.
- Operating temp:-40-150℃.
- Rapid heat transfer.
Carbon Fiber Thermal Pad
- Thermal conductivity: 15-45 W/mK.
- Low thermal resistance.
- Excellent stability.
- High compressibility.
Boron Nitride Thermal Pad
- Thermal conductivity: 8-20 W/mK.
- Electrical insulation.
- Cut-resistant.
- High-performance elastomer.
.webp "Silicone Thermal Pad")
Silicone Thermal Pad
- Low thermal resistance.
- Phase change at 45-55°C.
- Naturally adhesive.
- Good wettability.
Thermal Interface Material Products Selection Guide
Comprehensive range of thermal interface solutions for different applications and performance requirements
Non-silicone Thermal Pad
- No silicone oil migration.
- No siloxane volatilization.
- Excellent tensile strength.
- Flame retardant properties.
Thermal Tape
- Low thermal resistance.
- High bonding strength.
- Reduces thermal impedance.
- Flexible application.
.webp "Thermal Conductive Insulating Film")
Thermal Conductive Insulating Film
- Excellent electrical insulation.
- High mechanical strength.
- Cut-resistant.
- High-performance elastomer.
Phase Change Materials
- Low thermal resistance.
- Phase change at 45-55°C.
- Naturally adhesive.
- Good wettability.
Thermal Potting Compound
- Sealing properties.
- Two-component.
- Waterproof and flame-retardant.
- Fixing/Securing.
Thermal Grease
- Minimum interface thickness: 0.02 mm.
- Low thermal resistance.
- Low viscosity.
- Excellent wettability.
Thermal Adhesives
- Excellent adhesion.
- Electrical insulation properties.
- Two-component.
- Flame retardant.
High Thermal Conductivity Materials Performance Selection Guide
Detailed performance characteristics of our flagship thermal interface material series
| Product Series | Graphene Thermal Pad | Boron Nitride Thermal Pad | Carbon Fiber Thermal Pad | Silicone Thermal Pad |
|---|---|---|---|---|
| Thermal Conductivity (W/mK) | 70.0 | 8.0~20 | 45.0 | 15.0 |
| Thermal Resistance (°C·in²/W) @30psi | 0.1 | 0.3 | 0.07 | 0.1 |
| Thickness Range (mm) | 0.3~10.0 | 0.3~10.0 | 0.3~12.0 | 0.3~10.0 |
| Density(g/cm³) | - | 1.6±0.2 | 2.6 | 3.2 |
| Operating Temperature (°C) | -40~150 | -40~150 | -50~160 | -50~200 |
| Flame Rating(UL 94) | V-0 | V-0 | V-0 | V-0 |
| Typical Applications | Chips, routers, capacitors, memory/VRAM. | Automotive sensors, fiber optic communication, medical devices. | 5G stations, chips,memory, video memory splitters, and relays. | Automotive electronics, mobile phones and laptop communication equipment. |
* Specifications are typical values. Custom formulations available for specific requirements.
Thermal Interface Material Application Selection Guide
Sheen Technology thermal interface materials are widely used in electronic device thermal management
Consumer Electronics
Thermal management for CPUs, GPUs in smartphones, tablets, laptops. Improves device performance stability and lifespan.
Automotive Electronics
Thermal solutions for battery management systems, onboard chargers, electronic control units in new energy vehicles.
Communication Equipment
Thermal management for power amplifiers and chipsets in 5G base stations, routers, switches, and network equipment.
AI intelligence
Thermal management for AI chips, accelerators, and edge computing devices. Ensures stable performance and long-term reliability under high workloads.
Servers/Data Centers
Thermal management for CPUs, GPUs, memory modules, and power supplies in servers and data center equipment.
Security Camera
A security camera cooling solution that prevents lens fogging and circuit malfunctions in outdoor surveillance systems.
About Sheen Technology
Sheen Electronic Technology Co., Ltd. is a high-tech enterprise specializing in the research, development, production, and sales of high-performance thermal interface materials. Founded in 2008, the company is headquartered in Dongguan, China, and boasts a modern production base and R&D center.
We are committed to providing superior thermal management solutions to global customers. Our product line includes silicone thermal pads, thermal paste, thermal adhesive, phase change materials, and more, which are widely used in consumer electronics, new energy vehicles, 5G communication, AI intelligence, and other fields.
- National high-tech enterprise with 30+ patent technologies
- ISO9001 quality management system certified
- Monthly capacity over 500,000 m², supports large volume orders
- Industry-university-research collaboration with multiple universities
- Serves 500+ global customers, including industry leaders
Contact Us
Request free samples, technical data sheets, or product consultation. Our engineering team provides professional support.
Dongguan Sheen Electronic Technology Co., Ltd.
Company Address
Building 2, Wanrong Industrial Park, Hengkong, Liaobu Town, Dongguan City, Guangdong Province, China
Phone Number
+86 13728278261
+86-769-22479425
Email Address
Tina: marketing@u-sheen.com
WeChat/Phone
+86 13728278261
+86 13542243751
Free Sample Service
We offer free sample testing for qualified B2B customers. Please complete the inquiry form with your specific requirements, and our technical sales representative will contact you within 24 hours.
