English
usheenthermal
This article explores thermal conductive sheet selection for FPCB-PCB bonding amid electronic device miniaturization and flexibility trends. It highlights a thermal pad addressing key challenges: ≥0.8W/MK thermal conductivity for efficient heat transfer, 60% elongation with 3-7MPa strength for deformation resistance, and air-expelling capability to form gap-free channels. Stable at -40℃ to 200℃, it supports precise die-cutting and easy operation, redefining bonding standards across electronics sectors.
This article explores how graphene and boron nitride thermal pads tackle overheating in high-performance intelligent driving chips. Graphene pads, boasting 70W/MK thermal conductivity, create an "ultra-fast heat dissipation channel" for the chip's core area with 25% compression rebound rate ensuring tight fit. Boron nitride pads, with 12-20W/MK thermal conductivity and high insulation, protect surrounding circuits. Together, they build a "core + peripheral" 3D heat dissipation network, boosting efficiency by 58%, passing ASIL-D certification, and solving issues like computing power frequency reduction from high temperatures.
This article focuses on the core role of thermal conductive materials in improving the performance of electronic devices. It introduces the company's technical accumulation and product lines in the field of thermal conductive materials (including thermal pads, phase change materials, thermal gels, etc.). Through application scenarios such as smartphones, laptops, and industrial electronic equipment, it explains how different thermal conductive materials solve heat dissipation problems and ensure efficient and stable operation of devices. It also mentions that the company can provide customized solutions and looks forward to the future prospect of thermal conductive materials helping electronic devices achieve continuous breakthroughs with the development of emerging technologies.
This article provides an in-depth analysis of the critical application of silicone-free thermal pads in photovoltaic inverters, revealing the core driver behind their replacement of traditional silicone-based materials: siloxane contamination. It elaborates on technical pain points related to thermal performance, mechanical stress, and long-term reliability, and systematically proposes comprehensive solutions spanning material formulation, structural design, and rigorous testing, while looking ahead at their developmental trends in high-reliability new energy equipment.
This article details the critical technical applications of non-silicone thermal pads in precision sensors like cameras and LiDAR. It explains the core reasons for their preferential use—to avoid optical contamination and electrical contact failure—and provides an in-depth analysis of their technical challenges, such as balancing thermal and mechanical properties, and the corresponding breakthroughs in materials and processing.
This article provides an in-depth technical analysis of synthetic pyrolytic graphite sheets (PGS) as the core passive cooling solution in modern smartphones. It explores the material science behind their ultra-high in-plane thermal conductivity (up to 2000 W/m·K), critical anisotropy, and the manufacturing challenges in achieving ultra-thin, flexible forms. The text also delves into the engineering hurdles of precision integration, including die-cutting, insulation, and mitigating thermal interface resistance.
As smartphone chip performance soars, thermal management becomes the critical bottleneck. This article provides a deep dive into how high-conductivity graphite sheets use unique 2D anisotropic thermal properties to spread SoC hotspots, work in synergy with Vapor Chambers, and enable sustained peak performance for gaming and AI in flagship phones.
Explore the critical role of thermal management in air conditioner electronic control modules and power devices. This article details the application, performance requirements, and selection of key thermal products like thermal grease, pads, gels, PCMs, graphite sheets, and heat sinks, helping you understand how to ensure efficient, stable AC operation and extend equipment life.
This article explores the critical importance of thermal conductive materials, linking their role to recent news on AI chip performance, data center cooling challenges, and New Energy Vehicle battery safety and fast-charging advancements, highlighting them as essential for high-tech stability and efficiency.
This article delves into the critical application of thermal pads in high-temperature, high-power-density 5G base stations. It highlights core considerations for selecting and using these materials, analyzes practical challenges related to performance, cost, reliability, and assembly encountered in deployment, and underscores the necessity of overcoming these hurdles to ensure stable 5G network operation.
Explore the crucial role of thermal potting compounds in robot motors, covering efficient heat dissipation, electrical insulation, mechanical protection, and environmental sealing. Discuss application processes, key parameter selection, and considerations for optimizing robot motor design and longevity.
An in-depth analysis of thermal gel's specific applications in key drone components like main control chips, ESCs, and image transmission modules. Details essential parameters for selection (thermal conductivity, insulation, stability) and application best practices. Provides professional guidance for optimizing drone thermal management design.
This article delves into the application of thermally conductive structural adhesives in new energy vehicle battery modules, analyzing key technical indicators, application methods, process optimization, and future trends.
In-depth analysis of the manufacturing process of conductive silicone pads with silicone cloth backing, emphasizing the key role of silicone cloth in enhancing mechanical strength, dimensional stability, and operability, as well as core steps in the process. Understand the manufacturing secrets and performance enhancement strategies of high-performance thermal interface materials (TIMs).
Discover the benefits of silicone-free thermal pads for high-precision electronic cooling. This article explores the issue of silicone contamination from traditional silicone pads and highlights how silicone-free alternatives offer superior performance, reliability, and broader process compatibility, especially in sensitive applications like aerospace, medical devices, and precision optics.
Sheen Technology Co., Limited.
Address: Flat/Rm 1405A 14/F The Belgian Bank Building Nos.721-725 Nathan Road MongKok KL HK
Tel: +86 13728278261
Dongguan Sheen Electronic Technology Co., Ltd.
Tel:+86-769-22479425
E-mail:Tina: marketing@u-sheen.com
WeChat/Phone: +86 13728278261
WhatsApp: +86 13542243751
Add: Room 101, 201, 301, 401, Building 2, No. 8 Hengzhutang Road, Liaobu Town, Dongguan City, Guangdong Province ,China
