Thermal Interface Materials (TIMs)
High-performance interface materials designed to fill microscopic gaps and improve heat transfer between components and heatsinks.
Up to 15 W/m·KExplore SHEEN’s latest thermal management and functional material solutions for advanced electronics, automotive, telecom, industrial, and energy applications.
Dongguan Sheen Electronic Technology Co., Ltd. is a functional materials manufacturer focused on research, development, and production for global electronics and industrial markets.
At SEMI-THERM 2026, SHEEN will present a focused portfolio of thermal management, protection, and electromagnetic compatibility materials designed to support high-performance electronic systems.
SHEEN serves customers in telecom, automotive, medical, computing, industrial, and related technology sectors.
Discover the core materials SHEEN will highlight at SEMI-THERM 2026 for thermal transfer, sealing, insulation, lightweight heat dissipation, and EMI control.
High-performance interface materials designed to fill microscopic gaps and improve heat transfer between components and heatsinks.
Up to 15 W/m·KSealing, cushioning, flame-retardant, and fire-barrier solutions for enclosures, battery systems, and industrial assemblies.
Sealing + Fire BarrierUltra-thin next-generation thermal pad solutions developed for lightweight, space-constrained, and high-heat-density applications.
Ultra-Thin DesignAdvanced thermal pad solutions aimed at combining thermal performance, thin construction, and electrical insulation.
Thermal + InsulationUltra-high thermal conductivity materials for demanding electronics and communication applications, with flexible, reworkable performance.
15–45 W/m·K
Functional materials developed to help improve electromagnetic compatibility and support stable system performance in compact electronic designs.
EMI ControlMore than materials — SHEEN brings application insight, scalable production, and flexible customization for real engineering projects.
From interface materials to silicone foam and advanced pad technologies, SHEEN supports diverse thermal and protection needs.
Thickness, hardness, reinforcement, adhesive options, and other tailored performance configurations are available for many product lines.
SHEEN supports scalable production with rolling, calendering, baking, die-cutting, packaging, and quality inspection processes.
The team works closely with customers to address heat transfer, insulation, sealing, and system reliability challenges.
SHEEN materials are designed for a wide range of advanced technology sectors requiring reliable thermal and functional material performance.
Communication equipment, 5G modules, and related electronics.
Battery systems, modules, power electronics, and vehicle components.
Chips, VRAM, storage devices, control boards, and thermal assemblies.
Industrial control equipment, sealing systems, and durable enclosures.
Precision devices requiring reliable insulation and heat management.
Routers, handheld devices, housings, speakers, and power supplies.
Fire-barrier, thermal insulation, and pack sealing related structures.
Power modules, amplifiers, converters, and related thermal interfaces.
Reach out to our technical team for product specifications, samples, or consultation on your specific application requirements.
Reach out to our technical team for product specifications, samples, or consultation on your specific application requirements.
Building 2, Wanrong Industrial Park, Hengkong, Liaobu Town, Dongguan City, Guangdong Province, China
+86 13728278261
+86 13542243751
Stop by Booth 202 to meet the SHEEN team and discuss how our thermal management and functional material solutions can support your next design, program, or production requirement.