Thermal gel

Thermal gel applied in electronic modules

In electronic modules, thermal gel is a key thermal interface material, filling gaps between heat-generating parts (like microprocessors, memory chips) and heat sinks or module casings. It has high thermal conductivity, enabling efficient heat transfer to prevent overheating.

With a gel-like consistency, it easily conforms to uneven surfaces, ensuring close contact even with microscopic irregularities. This adaptability minimizes thermal resistance, crucial for compact modules with dense component layouts.​
It’s easy to apply—dispensed or spread precisely—without requiring high pressure during installation, protecting delicate module components. Its stability over temperature cycles maintains performance, enhancing the reliability of electronic modules in various operating conditions.