English
usheenthermal
The innovative non-silicon thermal conductive gel is specially developed to solve the high-temperature failure problem of BDU in new energy vehicles. It has a tunable thermal conductivity of 1-10 W/m·K and can significantly reduce the interface thermal resistance to below 0.05 °C·cm²/W. The product has passed the UL94 V0 flame retardant certification and has excellent insulation performance (10¹⁴ Ω·cm), remaining stable in extreme environments ranging from -40°C to 150°C. In practical applications, it can improve heat dissipation efficiency by 25% and reduce the defect rate by 75%, making it an ideal choice for thermal management in the high-voltage systems of new energy vehicles.
In industrial production, high temperatures can cause industrial cameras to "go on strike", thereby affecting the detection efficiency. The silicon-free thermal phase-change sheet solves this problem with its 3-6W/MK thermal conductivity and low thermal resistance design. When heated, it turns into a semi-fluid state and adheres to the microscopic gaps, cools down and solidifies to maintain the adhesion, ensuring smooth heat conduction. The fully organic and silicon-free formula has zero volatility and does not contaminate optical components at 85℃, ensuring clear imaging. Test results show that after using a 20 million pixel camera, the sensor temperature remains below 55℃. The equipment in the vehicle inspection workshop operates efficiently for 12 consecutive hours, the false detection rate significantly decreases, a large amount of cost is saved annually, and the ultra-thin design is suitable for compact chassis.
This article presents boron nitride thermal conductive gaskets as a solution to drones' overheating issues. High temperatures from motors and chips hinder drones' stability, battery life, and durability. These gaskets offer 12-20W/MK thermal conductivity (3-6x better than traditional silicone), 2.2g/cm³ low density (60% lighter than metal sinks), and insulation (volume resistance over 10¹⁴Ω・cm) for safe heat transfer. Real cases show agricultural drones extended operation by 75% with 70% fewer faults, while industrial ones kept chips below 55℃ during 4-hour high-temperature work, breaking heat dissipation bottlenecks.
This article explains why silicone-free thermal pads are the ultimate solution for PDU heat dissipation challenges in data centers. Unlike traditional silicone pads that leak oil and cause oxidation, these innovative pads eliminate silicone migration while improving heat transfer by 30%. Their low-hardness design (Shore 00 30-50) ensures perfect contact with components, even in extreme temperatures (-40°C to 120°C), and provides high-voltage protection (≥5kV/mm). Discover how this breakthrough technology prevents overheating, reduces failures, and extends PDU lifespan—making it the smart choice for reliable power distribution.
This article explains how silicon-free ultra-soft thermal conductive materials reshape heat dissipation in optical communications. They put an end to silicone oil contamination, a critical issue for high-speed modules like 800G and beyond. With their ultra-soft nature, these materials achieve excellent interface fit, boosting heat transfer efficiency compared to traditional options. They enhance reliability, extend device lifespan, and offer long-term cost advantages, making them key for future optical communication developments like CPO architecture.
This article explores why graphene thermal pads are hailed as the savior for heat dissipation in AI data centers. It highlights the heat dissipation challenges of AI data centers, introduces graphene thermal pads' ultra-high thermal conductivity (70W/(m·K)) and excellent mechanical properties, presents practical application effects, and looks forward to their future development prospects.
Discover ideal thermal material for chip testing—high-performance carbon fiber gaskets with superior conductivity and resilience, solving heat issues, yield fluctuations, cost problems.
This article explores thermal conductive sheet selection for FPCB-PCB bonding amid electronic device miniaturization and flexibility trends. It highlights a thermal pad addressing key challenges: ≥0.8W/MK thermal conductivity for efficient heat transfer, 60% elongation with 3-7MPa strength for deformation resistance, and air-expelling capability to form gap-free channels. Stable at -40℃ to 200℃, it supports precise die-cutting and easy operation, redefining bonding standards across electronics sectors.
This article explores how graphene and boron nitride thermal pads tackle overheating in high-performance intelligent driving chips. Graphene pads, boasting 70W/MK thermal conductivity, create an "ultra-fast heat dissipation channel" for the chip's core area with 25% compression rebound rate ensuring tight fit. Boron nitride pads, with 12-20W/MK thermal conductivity and high insulation, protect surrounding circuits. Together, they build a "core + peripheral" 3D heat dissipation network, boosting efficiency by 58%, passing ASIL-D certification, and solving issues like computing power frequency reduction from high temperatures.
This article focuses on the core role of thermal conductive materials in improving the performance of electronic devices. It introduces the company's technical accumulation and product lines in the field of thermal conductive materials (including thermal pads, phase change materials, thermal gels, etc.). Through application scenarios such as smartphones, laptops, and industrial electronic equipment, it explains how different thermal conductive materials solve heat dissipation problems and ensure efficient and stable operation of devices. It also mentions that the company can provide customized solutions and looks forward to the future prospect of thermal conductive materials helping electronic devices achieve continuous breakthroughs with the development of emerging technologies.
This article provides an in-depth analysis of the critical application of silicone-free thermal pads in photovoltaic inverters, revealing the core driver behind their replacement of traditional silicone-based materials: siloxane contamination. It elaborates on technical pain points related to thermal performance, mechanical stress, and long-term reliability, and systematically proposes comprehensive solutions spanning material formulation, structural design, and rigorous testing, while looking ahead at their developmental trends in high-reliability new energy equipment.
This article details the critical technical applications of non-silicone thermal pads in precision sensors like cameras and LiDAR. It explains the core reasons for their preferential use—to avoid optical contamination and electrical contact failure—and provides an in-depth analysis of their technical challenges, such as balancing thermal and mechanical properties, and the corresponding breakthroughs in materials and processing.
In an era of shrinking processor sizes and rapidly increasing power density, heat dissipation has become a major obstacle to electronic innovation. Synthetic graphite sheets have emerged as an ideal solution for engineers tackling localized "hot spots" in increasingly thinner devices.
As smartphone chip performance soars, thermal management becomes the critical bottleneck. This article provides a deep dive into how high-conductivity graphite sheets use unique 2D anisotropic thermal properties to spread SoC hotspots, work in synergy with Vapor Chambers, and enable sustained peak performance for gaming and AI in flagship phones.
Explore the critical role of thermal management in air conditioner electronic control modules and power devices. This article details the application, performance requirements, and selection of key thermal products like thermal grease, pads, gels, PCMs, graphite sheets, and heat sinks, helping you understand how to ensure efficient, stable AC operation and extend equipment life.